GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/128017) for “OPTICAL TRANSMISSION ASSEMBLY AND DISPLAY APPARATUS”. With publication no. WO/2026/170742, here are the... और पढ़ें
GENEVA, Aug. 21 -- UNIDT (SHANGHAI) CO., LTD. filed a patent application (CN2025/127242) for “LARGE MODEL ARCHITECTURE IN IRON AND STEEL INDUSTRY”. With publication no. WO/2026/170737, here are the ot... और पढ़ें
GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/127283) for “PAGING METHOD AND APPARATUS”. With publication no. WO/2026/170738, here are the other details related t... और पढ़ें
GENEVA, Aug. 21 -- JIANGSU XCMG CONSTRUCTION MACHINERY RESEARCH INSTITUTE LTD. filed a patent application (CN2025/127494) for “POWER BATTERY AND CONSTRUCTION MACHINERY”. With publication no. WO/2026/1... और पढ़ें
GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/126993) for “INFORMATION TRANSMISSION METHOD, COMMUNICATION APPARATUS AND STORAGE MEDIUM”. With publication no. WO/2... और पढ़ें
GENEVA, Aug. 21 -- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. filed a patent application (CN2025/127084) for “MODULE BRACKET, FRONT WINDOW MODULE AND SERVER”. With publication no. WO/2026/17073... और पढ़ें
GENEVA, Aug. 21 -- CHINA CONSTRUCTION THIRD ENGINEERING BUREAU (SHENZHEN) CO., LTD. filed a patent application (CN2025/127179) for “ELEVATOR POTENTIAL SAFETY HAZARD INSPECTION METHOD, AIRCRAFT, UNMANN... और पढ़ें
GENEVA, Aug. 21 -- YUNNAN POWER GRID CO., LTD filed a patent application (CN2025/125549) for “METHOD AND SYSTEM FOR INTEGRATED DESIGN OF INTELLIGENT WAVEFORM RECORDING AND TRAVELING-WAVE-BASED DISTANC... और पढ़ें
GENEVA, Aug. 21 -- YUNNAN POWER GRID CO., LTD filed a patent application (CN2025/125553) for “DIGITAL OPERATION AND MAINTENANCE METHOD AND SYSTEM FOR RELAY-PROTECTION SECONDARY CIRCUIT”. With publicat... और पढ़ें
GENEVA, Aug. 21 -- NANCHANG LABORATORY filed a patent application (CN2025/126412) for “METHOD FOR MANUFACTURING MICRO-LED LIGHT-EMITTING MODULE BY MEANS OF SEMI-TRANSPARENT METAL BONDING LAYER”. With ... और पढ़ें